Waferpedia

Tegal

901e

Etch75 mm to 150 mm round substrates; rectangular substrates from 100 mm to 125 mm on a sidedown to 0.5 micronIntroduced 900 SeriesTegal 901e family
Research Quality: 40% complete
901e — web.archive.org
Fig. 01901eweb.archive.org[1]
  • Plate 01Tegal and Main Equipment Introduction Tegal 901e Tegal 903e Plasma Etcher

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  • Plate 02Upgrade Kit-Tegal 901e 903e 981 983 Plasma Etcher

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  • Plate 03Tegal 901e Tegal 903e Tegal 901e TTW Tegal 903e TTW Plasma Etch Semiconductor Equipment

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  • Plate 04Allwin21 AW-901eR AW903eR Plasma Etcher RIE equipment, Reactive Ion Etching, -Tegal 901e Tegal 903e

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  • Plate 05AW-90XeR Plasma Etcher (Upgraded Tegal 901e, Tegal 903e)

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  • Plate 06Tegal 901e Tegal 903e Dry Plasma Etcher RIE semiconductor equipment

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Wafer size

75 mm to 150 mm round substrates; rectangular substrates from 100 mm to 125 mm on a side

Introduced

2000

Node / era

down to 0.5 micron

What is it?

Sources describe the Tegal 901e as a diode plasma etcher with a fixed electrode gap of 38 mm and a production-proven transport system. It is stated to handle 75 mm to 150 mm round silicon and GaAs substrates, and to be configurable for rectangular substrates from 100 mm to 125 mm on a side. Reported uses include GaAs device etching, polysilicon, oxide, nitride, backside, descum, and related semiconductor applications.

What can it run?

Process applications and technology nodes documented for this tool.

  • GaAs device etching
  • LOCOS nitride etch
  • nitride contact/via etch
  • zero layer etch
  • backside etch
  • isotropic oxide etch
  • photoresist descum
  • non-critical polysilicon etch
  • titanium/tantalum alloy etch
  • polysilicon etching
  • oxide etching

What do the numbers mean?

Wafer handling2

Round substrate handling
75 mm to 150 mm round silicon and GaAs substrates[2]
Accurate?
Rectangular substrate handling
rectangular substrates from 100 mm to 125 mm on a side[2]
Accurate?

Configuration & options3

Type
diode plasma etcher[2]
Accurate?
Fixed electrode gap
38 mm[2]
Accurate?
Design-rule suitability
best suited for technology design rules down to 0.5 micron[2]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 901e are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 901e are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 901e are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 901e are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 901e are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the 901e are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
  3. [3]TEGAL RECEIVES ORDER FOR 900 SERIES ETCH SYSTEMS FROM OPTO TECHweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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