Waferpedia

Comparison ledger

0041-39086 ESC Partversus983

Applied Materials 0041-39086 ESC Part, Tegal 983, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
983Tegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—125mm
Process node—down to 0.5 micron
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Tegal 983
Specifications
Model—983[1]
Product name—983 ACS[1]
Category—Diode plasma etch tool[2]
Fixed electrode gap—6 mm[2]
Round substrate size—125 mm to 150 mm round silicon and GaAs substrates[2]
Rectangular substrate size—125 mm to 150 mm on a side[2]
Best-suited design rules—down to 0.5 micron[2]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org