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Tegal

983

Etch125mmdown to 0.5 micronTegal 983 family
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The Tegal 983 is a diode plasma etch tool. The Tegal 983 has a fixed electrode gap of 6 mm. The Tegal 983 is best suited for technology design rules down to 0.5 micron.[1][2]

Tegal983
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Wafer size

125mm

Node / era

down to 0.5 micron

What it is

The Tegal 983 is a diode plasma etch tool.[1][3][2][4]

The Tegal 983 is part of the Tegal 900 and 980 series etcher family.[1]

How it works

The Tegal 983 uses a fixed electrode gap of 6 mm.[1][2]

The Tegal 983 is designed around a production-proven transport system.[1][2]

Where it fits in the process flow

The Tegal 983 is suited to semiconductor and related compound-semiconductor process flows that require non-critical etch steps and planarization-related etches.[1][3]

Applications

The Tegal 983 accommodates 125 mm to 150 mm round silicon and GaAs substrates.[1][2]

The Tegal 983 can be configured for rectangular substrates from 125 mm to 150 mm on a side.[1][2]

The Tegal 983 is used for pad passivation etch, oxide contact or via etch, LDD spacer etch, polyimide ILD etch, and resist or SOG planarization.[1][3][2][4]

  • pad passivation etch
  • oxide contact/via etch
  • LDD spacer etch
  • polyimide ILD etch
  • resist/SOG planarization

What do the numbers mean?

Wafer handling3

Round substrate size
125 mm to 150 mm round silicon and GaAs substrates[1]
Accurate?
Rectangular substrate size
125 mm to 150 mm on a side[1]
Accurate?
Wafer size
125mm[2]
Accurate?

Configuration & options7

Model
983[3]2 sources
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Product name
983 ACS[3]
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Category
Diode plasma etch tool[1]
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Fixed electrode gap
6 mm[1]
Accurate?
Best-suited design rules
down to 0.5 micron[1]
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Category
Etch[2]
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Tool type
diode plasma etch tool[1]
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What replaced it?

  • siblingTegal 981— The source describes the 981 as a diode plasma etch tool in the same product family.source[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes does the Tegal 983 handle?

The Tegal 983 accommodates 125 mm to 150 mm round silicon and GaAs substrates. The Tegal 983 can also be configured for rectangular substrates from 125 mm to 150 mm on a side.[1][2]

What is the electrode gap on the Tegal 983?

The Tegal 983 has a fixed electrode gap of 6 mm.[1][2]

What process types is the Tegal 983 used for?

The Tegal 983 is used for pad passivation etch, oxide contact or via etch, LDD spacer etch, polyimide ILD etch, and resist or SOG planarization.[1][3][2][4]

Not publicly documented

The following facts about the 983 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 983 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 983 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 983 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 983 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the 983 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]web.archive.org — web.archive.orgweb.archive.org
  4. [4]Tegal 983 family | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 13, 2026.

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