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Comparison ledger

Centura 4.0 Radiance RTPversus1088

Applied Materials Centura 4.0 Radiance RTP, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Centura 4.0 Radiance RTPApplied Materials
1088Heller
OEMApplied MaterialsHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura 4.0 Radiance RTPHeller 1088
Specifications
ManufacturerApplied Materials[1]—
ModelCentura 4.0 Radiance[2]—
System typeRapid Thermal Process[1]—
CategoryThermal / Diffusion[1]—
Vintage2002[2]—
Version300 mm[3]—
Heating Zones—8 zones (4 top and 4 below) plus 1 cooling zone[4]
Heating Method—Forced convection[4]
Conveyor Width—18 inches (45 cm)[4]
Heated Length—43.5 inches (111 cm)[4]
Overall Length—96 inches (244 cm)[4]
Height—50 inches (127 cm)[4]
Net Weight—900 lbs (409 kg)[4]
Thermal Profiler—Included[4]
Oven Top—Counter balance for easy access to conveyor[4]
Solder Compatibility—Lead-free and leaded soldering[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]smtdevices.comsmtdevices.com