Heller
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The Heller 1088 is a forced-convection reflow oven used for SMT PCB assembly. The Heller 1088 has 8 heating zones (4 top and 4 below) and 1 cooling zone.[1]
The Heller 1088 is a forced-convection reflow oven used for surface-mount technology (SMT) printed circuit board (PCB) assembly. The Heller 1088 is designed for medium- to high-volume PCB assembly. The Heller 1088 is suitable for both lead-free and leaded soldering processes.[2]
The Heller 1088 uses forced-convection heating to achieve consistent solder reflow. The Heller 1088 has eight heating zones, with four zones above the conveyor and four zones below. The Heller 1088 also includes one cooling zone. The Heller 1088 offers fast thermal response with good temperature uniformity. The oven supports recipe storage and programmable thermal profiles.[2]
Reflow ovens are positioned after pick-and-place machines in the SMT assembly line. Reflow ovens melt solder paste to form permanent electrical and mechanical connections between surface-mount components and the PCB. After reflow, the assembled board typically moves to inspection and test stations.
The Heller 1088 is used for reflow soldering in PCB assembly. The Heller 1088 supports both lead-free and leaded solder paste processes.[2]
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The Heller 1088 has eight heating zones, configured as four zones above the conveyor and four zones below.[2]
Yes, the Heller 1088 is suitable for both lead-free and leaded soldering.[2]
The conveyor width of the Heller 1088 is 18 inches (45 cm).[2]
The heated length of the Heller 1088 is 43.5 inches (111 cm).[2]
The overall length of the Heller 1088 is 96 inches (244 cm).[2]
The following facts about the 1088 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1088 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1088 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1088 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1088 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1088 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 20, 2026.