Comparison ledger
Applied Materials Endura 2, CHA Mark 50, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Endura 2Applied Materials | Mark 50CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Endura | CHA Mark 50 |
| Specifications | ||
| Configuration | Liner / Barrier[2] | updated to control the deposition and chambers.[10] |
| Software Version | 2.10_692[4] | — |
| System Power Rating | 208VAC/480VAC[4] | — |
| Loading Configuration | 3 TDK Loadports[4] | — |
| Chamber 1 | Impulse PVD[4] | — |
| Chamber 2 | Impulse PVD[4] | — |
| Chamber 3 | Impulse PVD[4] | — |
| Chamber E | DMD[4] | — |
| Chamber F | DMD[4] | — |
| Fi Robot | Yasakawa[6] | — |
| Wafer Carrier | 5x4" Wafer pocket, 4" Tray[9] | — |
| SiC Tray | 4", 6 hole, SiC Carrier (2 pc)[9] | — |
| Dry Pump | (2)[9] | — |
| Wafer Size | 12 inch (300 mm)[2] | — |
| Category | PVD (Physical Vapor Deposition)[2] | — |
| Front Interface Version | 5.3[4] | — |
| Mainframe | Endura II[4] | — |
| Chamber Configuration | 3 Impulse PVD chambers (Chambers 1-3), 2 DMD chambers (Chambers E and F)[4] | — |
| Robot Type | XP[2] | — |
| Pump | Dedicated[2] | — |
| Process type | — | Physical Vapor Deposition (PVD)[11] |
| Wafer size | — | 6 inch[11] |
| Deposition type | — | Thin-film deposition[12] |
| Control upgrade | — | Computer added to track processes[10] |
| Power supply upgrade | — | New Glassman voltage supply[10] |
| Controller upgrade | — | Updated Infinicon controller[10] |
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