Applied Materials
Endura 2
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What it is
Applied Materials Endura 2 is a physical vapor deposition system used for semiconductor metal deposition. It is configured here for 12-inch wafers.[1]
How it works
General reference — not yet source-verifiedA physical vapor deposition system forms thin films by transporting material from a source in vacuum and depositing it onto wafer surfaces. In this class of equipment, wafers are loaded into a transfer and process system, moved to deposition chambers, and coated under controlled conditions.
Where it fits in the process flow
General reference — not yet source-verifiedThis type of system belongs in the metallization portion of semiconductor fabrication, where conductive and barrier films are added after earlier patterning or surface preparation steps and before later interconnect formation steps.
What can it run?
Process applications and technology nodes documented for this tool.
- Liner / Barrier
- Metal Deposition
- Front-End Metallization
- Aluminum Interconnect
What do the numbers mean?
Vacuum & pumping1
- Dedicated Pump[1]
Wafer handling3
Control & software2
- Front Interface Version 5.3[2]
Configuration & options20
- Liner / Barrier[1]
- Metal Deposition[1]
- 3 Loadports[1]
- Liner/Barrier[7]
- Front-End[2]
- Endura II Mainframe[2]
- Can be fully refurbished with HDD replacement and reconfigured[2]
- Front-End Metallization[8]
- Aluminum Interconnect[3]
- Ell Mf[3]
- STD Blades[3]
- 3 Ch[9]
- W 3CH, DMD 2CH[10]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationDedicated Pump[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Endura 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Endura 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Endura 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Endura 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Endura 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Endura 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (12)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]inventory listing
- [8]inventory listing
- [9]inventory listing
- [10]inventory listing
- [11]Equipment inventory listing
- [12]Applied Materials, Inc. - Breaking the 65nm Barrier — appliedmaterials.com (Oct 16, 2004)web.archive.org
Last updated Jul 30, 2026.
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