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Comparison ledger

Endura HPversusDiscovery Cathode

Applied Materials Endura HP, Denton Vacuum Discovery Cathode, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Documented as functional equivalents— Same function class: Deposition, null[1]
Side-by-side comparison of selected equipment models
Attribute
Endura HPApplied Materials
Discovery CathodeDenton Vacuum
OEMApplied MaterialsDenton Vacuum
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials EnduraDenton Vacuum Discovery
Specifications
Voltage208 VAC[2]—
Configuration50/60 Hz[2]12.0" sputtering system with planetary Load lock and robot loading assemblies[3]
Full Load Current416 A[2]—
Maximum System Rating150 KVA[2]—
Ampere Rating of Largest Load200 A[2]—
Interrupt Current10,000 AMPS I.C.[2]—
Power208 VAC[2]—
Frequency50/60 Hz[2]—
Version200 MM[1]—
Vintage01.06.2005[1]—
Sputtering system size—12.0 inch[3]
Chamber dimensions—Approx. 4' X 6' X 12" Stainless Steel Chamber[3]
Ion source—Veeco 5 cm Gridded Ion Source with Gas Controls[4]
High vacuum pump—CTI Cryogenics High Vacuum Pump/Blanket Heater[3]
Cryopump—Torr400 Cryopump with Oxford E500 Dual Temperature Monitor[3]
Turbo molecular pump—KYKY F400 Turbo Molecular Pump with FV-LII Pump Controller[3]
Compressor—CTI-Cryogenics 9600 Compressor[3]
DC power supplies—(4) Advance Energy Pinnacle plus DC Power Supplies[4]
Cathodes—(4) 12" Cathodes[3]
Robot—Loader/Unloader with Epson G6-453c Robot, Vintage 9/10[3]
Controller—Ion Tech Mps-3000 fc Controller[3]
Load lock—Load Lock Loader with PLC Controller[3]
Gate valve—Vat Gate Valve[3]
Adaptive pressure controller—Vat Adaptive Pressure Controller[3]
Pressure monitors—Assorted Pressure Monitors[3]
Isolation valves—Isolation Valves[3]
Power supply/control—Stand Alone Power Supply/Control[3]
Computer system—Computer System with Related Hardware/Software[3]
Manufacturer—Denton Vacuum[3]
Model—Discovery Cathode[3]
Category—Deposition[4]
Process type—Sputtering system[4]
Wafer size—12.0-inch[4]
Wafer handling—Planetary load lock and robot loading assemblies[4]
Chamber—Approx. 4' x 6' x 12" stainless steel chamber[3]
Vacuum pumps—CTI Cryogenics high vacuum pump/blanket heater; Torr400 cryopump with Oxford E500 dual temperature monitor; KYKY F400 turbo molecular pump with FV-LII pump controller[3]
Pressure control—Vat gate valve and Vat adaptive pressure controller[3]
Control system—Ion Tech Mps-3000 fc controller; stand alone power supply/control; computer system with related hardware/software[3]
Robot loader/unloader—Epson G6-453c robot[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com