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Comparison ledger

Mirra 3400 versus 3806 L

Applied Materials Mirra 3400 and GigaMat 3806 L, side by side. Every value shown is drawn from its cited encyclopedia entry.

Documented as functional equivalentsSame function class: CMP, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
Mirra 3400Applied Materials
3806 LGigaMat
OEMApplied MaterialsGigaMat
CategoryCMPCMP
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones1998 Vintage · 2001 Vintage
Control system
Generation
FamilyApplied Materials MirraGigaMat 3806 L
Cited variants
  • Mirra 3400 Stand-Alone[2]
Specifications
Cassette Que4 Wet[3]
HandlingWet In / Wet Out[3]
Platens3[3]
Polish Heads4[3]
Slurry DeliveryRotary pump (6)[3]
Slurry ConfigurationAB, AB w/ Position Sensor[3]
Slurry Delivery Arm TypeExtended w/ 4 Outputs[3]
ISRM P 1iScan / Full Scan/M. Torque[3]
ISRM P 2Full Scan/M. Torque[3]
ISRM P 3Full Scan/M. Torque[3]
UPAIT / RR / MEM[3]
UPA SupplyNitrogen Gas[3]
Head TypesTitan I[3]
Pad ConditionerDDF 3[3]
Min / Max Platen Speed0 -125 rpm[3]
Min / Max Slurry Flow15 - 400 ml/mn[3]
Min / Max Head pressure0.7 - 14 psi[3]
Min / Max PC Downforce3.0 - 17 lbf[3]
Endpoint SoftwareIB 11 J 1[3]
Polisher Softwaremp 2 B 6.2_36[3]
Wafer sizes150 mm, 200 mm (6 inch, 8 inch)[3]
Number of platens3[3]
Number of polish heads4[3]
Head typeTitan I[3]
Platen speed range0 – 125 rpm[3]
Slurry flow rate range15 – 400 ml/min[3]
Head pressure range0.7 – 14 psi[3]
PC downforce range3.0 – 17 lbf[3]
Handling typeWet In / Wet Out[3]
Operating systemWindows NT 4.00.1381 or above[2]
Electrical requirements200/208 VAC, 200 A, 45 kVA[4]
Endpoint software versionIB 11 J 1[3]
Polisher software versionmp 2 B 6.2_36[3]
ConfigurationWith Water Jet[1]
Voltage480 VAC[1]
Frequency60 Hz[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]smtnet.comsmtnet.com