Waferpedia

Applied Materials

Mirra 3400

CMPApplied Materials Mirra family
Research Quality: 50% complete

The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing. The Mirra 3400 supports multiple technologies including oxide, STI, tungsten, and copper CMP, as well as polyimide and amorphous silicon materials.[1]

Mirra 3400 — Inventory photo
Fig. 01Mirra 3400Inventory photo[3]

Power

200/208 VAC, 200 A, 45 kVA[1]

Vacuum

Rotary pump (6)[3]

Gas delivery

AB, AB w/ Position Sensor[3]

What it is

The Applied Materials Mirra 3400 is a chemical mechanical polishing system for semiconductor wafer processing.[2][1]

The Mirra 3400 appears in a standalone CMP configuration and in an oxide and STI CMP configuration.[5]

How it works

General reference — not yet source-verified

A CMP tool removes material by combining mechanical pad action with chemical slurry action on the wafer surface.

Where it fits in the process flow

General reference — not yet source-verified

The Mirra 3400 belongs in the wafer planarization portion of the fab flow, after front end patterning steps that leave films or topography requiring surface conditioning.

Applications

The Mirra 3400 is used for oxide and STI planarization.[5]

What do the numbers mean?

Power & electrical1

Electrical requirements
200/208 VAC, 200 A, 45 kVA[1]
Accurate?

Vacuum & pumping3

Slurry Delivery
Rotary pump (6)[3]
Accurate?
Min / Max Head pressure
0.7 - 14 psi[3]
Accurate?
Head pressure range
0.7 – 14 psi[3]
Accurate?

Wafer handling2

Cassette Que
4 Wet[3]
Accurate?
Wafer sizes
150 mm, 200 mm (6 inch, 8 inch)[3]
Accurate?

Gas & chemistry5

Slurry Configuration
AB, AB w/ Position Sensor[3]
Accurate?
Slurry Delivery Arm Type
Extended w/ 4 Outputs[3]
Accurate?
UPA Supply
Nitrogen Gas[3]
Accurate?
Min / Max Slurry Flow
15 - 400 ml/mn[3]
Accurate?
Slurry flow rate range
15 – 400 ml/min[3]
Accurate?

Control & software7

Min / Max PC Downforce
3.0 - 17 lbf[3]
Accurate?
Endpoint Software
IB 11 J 1[3]
Accurate?
Polisher Software
mp 2 B 6.2_36[3]
Accurate?
PC downforce range
3.0 – 17 lbf[3]
Accurate?
Operating system
Windows NT 4.00.1381 or above[5]
Accurate?
Endpoint software version
IB 11 J 1[3]
Accurate?
Polisher software version
mp 2 B 6.2_36[3]
Accurate?

Configuration & options15

Handling
Wet In / Wet Out[3]
Accurate?
Platens
3[3]
Accurate?
Polish Heads
4[3]
Accurate?
ISRM P 1
iScan / Full Scan/M. Torque[3]
Accurate?
ISRM P 2
Full Scan/M. Torque[3]
Accurate?
ISRM P 3
Full Scan/M. Torque[3]
Accurate?
UPA
IT / RR / MEM[3]
Accurate?
Head Types
Titan I[3]
Accurate?
Pad Conditioner
DDF 3[3]
Accurate?
Min / Max Platen Speed
0 -125 rpm[3]
Accurate?
Number of platens
3[3]
Accurate?
Number of polish heads
4[3]
Accurate?
Head type
Titan I[3]
Accurate?
Platen speed range
0 – 125 rpm[3]
Accurate?
Handling type
Wet In / Wet Out[3]
Accurate?

Vintage & configurations

  1. 1998Vintage[2]

    One source states 1998 vintage.

  2. 2001Vintage[3]

    One source states 2001 vintage.

Documented models & variants

DesignationGenerationVintageChangesSource
Mirra 3400 Stand-Alone1996Stand-alone configuration for Oxide/STI CMP, includes wet-in-wet-out handling and specific options such as TITAN1 UPA, DDF3 pad conditioner, and Windows NT control.fabsurplus.com[5]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Slurry DeliveryRotary pump (6)[3]
  • Slurry ConfigurationAB, AB w/ Position Sensor[3]
  • Slurry Delivery Arm TypeExtended w/ 4 Outputs[3]
  • UPA SupplyNitrogen Gas[3]
  • Min / Max Slurry Flow15 - 400 ml/mn[3]
  • Min / Max Head pressure0.7 - 14 psi[3]
  • Slurry flow rate range15 – 400 ml/min[3]
  • Head pressure range0.7 – 14 psi[3]
  • Electrical requirements200/208 VAC, 200 A, 45 kVA[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the Mirra 3400 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • The control-system platform and OS era of the Mirra 3400 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Mirra 3400 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Mirra 3400 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Mirra 3400 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the Mirra 3400 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]smtnet.comsmtnet.comsmtnet.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Inventory photo
  5. [5]fabsurplus.comfabsurplus.comfabsurplus.com
  6. [6]Equipment inventory listing
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Last updated Aug 14, 2026.

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