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Comparison ledger

AB 559 A 06 Wedge versus IBond 5000

ASM AB 559 A 06 Wedge and Kulicke & Soffa IBond 5000, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Documented as functional equivalents— Same function class: Packaging & Bonding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
AB 559 A 06 WedgeASM
IBond 5000Kulicke & Soffa
OEMASMKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AB 559Kulicke & Soffa IBond 5000
Specifications
Configuration50/60 Hz[1]Ball-wedge bonding capability[3]
Software vs2.42[2]—
Spool Size—Ball bonding 2" x 1" double flange spool[3]
Bonding Area—135 x 135 mm (5.3 x 5,3 ")[3]
Throat Depth—143 mm (5.6")[3]
Gross Table Motion—14 mm (o.55")[3]
AB 559 A 06 Wedge entryIBond 5000 entry

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing