Kulicke & Soffa
IBond 5000
What is it?
What do the numbers mean?
Power & electrical1
- 100-240 V, 50/60 Hz[1]
Dimensions & facilities1
Configuration & options18
- Ball-wedge bonding capability[1]
- Wire feed angle 90 degrees, vertical feed[1]
- Gold Wire Diameter:[1]
- Ball bonding and wedge bonding[1]
- 0.7 mil to 3.0 mil diameter[1]
- 17 micron to 75 micron diameter[1]
- Copper Wire[1]
- 0.7 mil ro 2 mil[1]
- 12 micron to 50 micron[1]
- Bonding Tool Specifications:[1]
- Ball bonding capillary lengths[1]
- 0.375"[1]
- 0.437"[1]
- 0.625"[1]
- XY Table:[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AB 559 A 06 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration100-240 V, 50/60 Hz[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the IBond 5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IBond 5000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IBond 5000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IBond 5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IBond 5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IBond 5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]K&S - Manual Wire Bonder — kns.com (Sep 5, 2012)web.archive.org
Last updated Jul 29, 2026.
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