Kulicke & Soffa
IBond 5000
The K&S IBond 5000 is a manual wire bonder manufactured by Kulicke & Soffa. The IBond 5000 features ball-wedge bonding capability. The IBond 5000 supports gold and copper wire diameters from 0.7 mil to 3.0 mil.[1][2]
What it is
How it works
Where it fits in the process flow
The IBond 5000 is used in packaging workflows that include gold wire bonding and copper wire bonding.[2]
Applications
The IBond 5000 supports gold wire and copper wire use.[1]
What do the numbers mean?
Power & electrical11
- 100-240 V, 50/60 Hz[1]
Control & software2
Dimensions & facilities4
- Bond force range
- 10-250 grams (requires added weights >80 grams), force coil range 3-80 grams[1]
Configuration & options50
- Ball-wedge bonding capability[1]
- Wire feed angle 90 degrees, vertical feed[1]
- Gold Wire Diameter:[1]
- Ball bonding and wedge bonding[1]
- 0.7 mil to 3.0 mil diameter[1]
- 17 micron to 75 micron diameter[1]
- Copper Wire[1]
- 0.7 mil ro 2 mil[1]
- 12 micron to 50 micron[1]
- Bonding Tool Specifications:[1]
- Ball bonding capillary lengths[1]
- 0.375"[1]
- 0.437"[1]
- 0.625"[1]
- XY Table:[1]
Vintage & configurations
- 2021Vintage[3]
The IBond 5000 is described as 2021 vintage.
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AB 559 A 06 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[5]
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[6]
- Branson 318-008-021 Horn— Same function class: Packaging & Bonding, nullCompare in depthsource[7]
- Shinkawa UTC 5000— Same function class: Packaging & Bonding, nullCompare in depthsource[8]
- Besi DS 9000 E— Same function class: Packaging & Bonding, nullCompare in depthsource[9]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration100-240 V, 50/60 Hz[1]
- Power supply100-240 V, 50/60 Hz[1]
- Ultrasonic transducer frequency60 kHz[1]
- Ultrasonic generatorPhase Lock Loop self-tuning[1]
- Low ultrasonic power1.3 watts[1]
- High ultrasonic power2.5 watts[1]
- Input power100-240 V, 50/60 Hz[1]
- Ultrasonic systemHigh Q 60kHz K&S transducer[1]
- Ultrasonic generatorPhase Lock Loop self-tuning ultrasonic generator[1]
- Power requirement100-240 V, 50/60 Hz[1]
- Ultrasonic transducerHigh Q 60 kHz K&S transducer[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding modes does the IBond 5000 support?
The IBond 5000 supports ball-wedge bonding capability.[1]
What wire materials are supported?
The IBond 5000 supports gold wire and copper wire.[1]
What wire diameter range is given for gold wire?
The gold wire diameter range is 0.7 mil to 3.0 mil, or 17 micron to 75 micron.[1]
What is the bonding area of the XY table?
The bonding area of the XY table is 135 by 135 mm.[1]
Not publicly documented
The following facts about the IBond 5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the IBond 5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IBond 5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IBond 5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IBond 5000 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the IBond 5000 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]web.archive.org — kns.com (Sep 5, 2012)web.archive.org
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
- [8]web.archive.orgweb.archive.org
- [9]Equipment inventory listing
Last updated Oct 12, 2026.
Compare with similar tools
View all →Branson 318-008-021 Horn is a circular high grain horn with a 3-inch diameter, 0.9 horn gain, and a black max booster.
The ASM AB 559 A 06 is a wedge bonder offered by ASM.
The Besi / Datacon DS 9000 E is a bonder with an 8-inch wafer size and 208 VAC single-phase, 50/60 Hz power specifications.
The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.
