Comparison ledger
ASM LinDA, Besi 2200 EVO, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LinDAASM | 2200 EVOBesi |
|---|---|---|
| OEM | ASM | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM LinDA | Besi 2200 |
| Cited variants |
| |
| Specifications | ||
| Voltage | 200 VAC, Single Phase[5] | — |
| Configuration | 50/60 Hz[5] | Dual Head[6] |
| Vintage (manufacture year) | 2012[5] | — |
| Machine type | Die bonder[1] | — |
| Category | Packaging & Bonding[1] | — |
| Power | 200 VAC, single phase, 50/60 Hz[5] | — |
| Vintage | 2012[5] | — |
| Power supply | — | 3 x 400 v[7] |
| U nominal | — | 3 x 400 V[7] |
| X/Y placement accuracy | — | ±10 µm @ 3s[3] |
| Theta placement accuracy | — | ±0.15° @ 3s[3] |
| Bond force | — | 0.5N to 75N programmable[3] |
| Throughput (die attach) | — | up to 7,000 UPH/module[3] |
| Throughput (flip chip with dipping) | — | up to 2,500 UPH/module[3] |
| Throughput (flip chip without dipping) | — | up to 3,200 UPH/module[3] |
| Number of working heads | — | up to 4[3] |
| Die size (die attach) | — | 0.17 mm - 50 mm[3] |
| Die size (flip chip) | — | 0.5 mm - 50 mm[3] |
| Die thickness | — | >50 µm (thinner on request)[3] |
| Wafer size | — | 4" - 12" (SEMI M1)[3] |
| Substrate working range | — | 13" x 8" (325 mm x 200 mm)[3] |
| Machine dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[3] |
| Weight | — | 1,300 kg[3] |
| Uptime | — | > 98 %[3] |
| Yield | — | > 99.95 %[3] |
| Heated bond head temperature | — | up to 450°C (optional)[3] |
| UV curing wavelengths | — | 365 nm & 405 nm[3] |
| UPH (Die attach) | — | up to 7,000 UPH/module[3] |
| UPH (Flip Chip with dipping) | — | up to 2,500 UPH/module[3] |
| UPH (Flip Chip without dipping) | — | up to 3,200 UPH/module[3] |
| Bond head rotation | — | 0° - 360°[3] |
| UV Curing | — | 365 nm & 405 nm[3] |
| Frame size | — | FF070, FF105, FF108, FF123; automatic change[3] |
| Head configuration | — | Dual Head[6] |
| Product type | — | High-accuracy multi-chip die bonder[3] |
| Applications | — | Die attach, flip chip, multi-chip[3] |
| Integrated dispenser | — | Yes[3] |
| Wafer handling | — | 12" wafer handling[3] |
| Automatic tool changer | — | Yes[3] |
| Die attach throughput | — | up to 7,000 UPH/module[3] |
| Flip chip throughput with dipping | — | up to 2,500 UPH/module[3] |
| Flip chip throughput without dipping | — | up to 3,200 UPH/module[3] |
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