Besi

2200 EVO

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2200 EVO — Inventory photo — Fig. 012200 EVOInventory photo^[1]

Power

3 x 400 v^[2]

Performance

±10 µm @ 3s^[10]

Optics

365 nm & 405 nm^[10]

What it is

The Besi Datacon 2200 evo is a high-accuracy multi-chip die bonder for die attach and flip chip applications.^[10]

The Datacon 2200 evo supports up to four working heads in one machine and can combine component placemint, dispenging, flux dipping and bonding in a single pass.^[10]

How it works

General reference — not yet source-verified

The machine can dispense epoxy or flux via stamping or writing methods, and the bond head picks dies from wafers, wafle packs, gel packs or feedrs.

Where it fits in the process flow

General reference — not yet source-verified

The die bonder operats in the back-end semiconduictor assembly flow, after wafer dicing and before wire bonding or molding.

Upstream steps include wafer grinding and dicing to singulate dies; downstream stepps incude wire bonding, encapsultion and final test.

What do the numbers mean?

Power & electrical2

Power supply: 3 x 400 v^[2]
U nominal: 3 x 400 V^[2]

Wafer handling2

Wafer size: 4" - 12" (SEMI M1)^[10]
Substrate working range: 13" x 8" (325 mm x 200 mm)^[10]

Optics & imaging1

UV curing wavelengths: 365 nm & 405 nm^[10]

Performance5

X/Y placement accuracy: ±10 µm @ 3s^[10]
Theta placement accuracy: ±0.15° @ 3s^[10]
Throughput (die attach): up to 7,000 UPH/module^[10]
Throughput (flip chip with dipping): up to 2,500 UPH/module^[10]
Throughput (flip chip without dipping): up to 3,200 UPH/module^[10]

Dimensions & facilities2

Machine dimensions (LxDxH): 1,160 mm x 1,225 mm x 1,750 mm^[10]
Weight: 1,300 kg^[10]

Configuration & options9

Dual Head^[1]
Bond force: 0.5N to 75N programmable^[10]
Number of working heads: up to 4^[10]
Die size (die attach): 0.17 mm - 50 mm^[10]
Die size (flip chip): 0.5 mm - 50 mm^[10]
Die thickness: >50 µm (thinner on request)^[10]
Uptime: > 98 %^[10]
Yield: > 99.95 %^[10]
Heated bond head temperature: up to 450°C (optional)^[10]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
Datacon 2200 evo plus	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[10]
Datacon 2200 evo hF	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[10]
Datacon 2200 evo hS	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[10]
Datacon 2200 evo advanced	—	—	New gantry & controller system, new vision and camera generation. X/Y placement accuracy: ±3 µm @ 3s, theta accuracy: ±0.07° @ 3s, bond force: 0.5N to 25N closed loop, die attach size: 0.15 mm - 30 mm, flip chip size: 0.5 mm - 30 mm. UV curing with up to 2,000 mW/cm² (365/405 nm).	besi.com^[11]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power supply3 x 400 v^[2]
U nominal3 x 400 V^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What is the throughput of the Datacon 2200 evo?

Die attach throughput is up to 7,000 UPH per module; flip chip with dipping up to 2,500 UPH; flip chip without dipping up to 3,200 UPH.^[10]

What wafer sizes can the Datacon 2200 evo handle?

The machine handles wafer sizes from 4 inches to 12 inches (SEMI M1).^[10]

What bond force range does the Datacon 2200 evo offer?

The bond force is programmable from 0.5 N to 75 N.^[10]

Not publicly documented

The following facts about the 2200 EVO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 EVO are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2200 EVO are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 EVO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 EVO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 EVO are on record.
Answerable by: an OEM parts catalog or a service engineer