Besi

2200 EVO

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The Besi Datacon 2200 evo is a high-accuracy multi-chip die bonder. The Besi Datacon 2200 evo supports die attach and flip chip applications. The Besi Datacon 2200 evo supports wafer sizes from 4" to 12" (SEMI M1).^[1]

2200 EVO — Inventory photo — Fig. 012200 EVOInventory photo^[2]

Power

3 x 400 v^[3]

Performance

±10 µm @ 3s^[1]

Optics

365 nm & 405 nm^[1]

What it is

The Besi Datacon 2200 evo is a high-accuracy multi-chip die bonder. The Besi Datacon 2200 evo is intended for die attach and flip chip applications. The Besi Datacon 2200 evo is equipped with an integrated dispenser, wafer handling up to 12 inches, an automatic tool changer, and application-specific tooling. The Besi Datacon 2200 evo supports up to 4 working heads in one machine.^[1]

How it works

The Besi Datacon 2200 evo picks die from wafer, waffle pack, gel pack, or feeder inputs. The Besi Datacon 2200 evo places die onto carrier, boat, substrate, PCB, lead frame, or wafer outputs. The Besi Datacon 2200 evo supports hot and cold processes including epoxy, soldering, and thermo-compression. The Besi Datacon 2200 evo can perform die attach, flip chip, and multi-chip work in one machine. The Besi Datacon 2200 evo supports epoxy writing and stamping as well as flux dipping.^[1]

The Besi Datacon 2200 evo has X/Y placement accuracy of ± 10 µm at 3 Sigma and theta placement accuracy of ± 0.15° at 3 Sigma. The Besi Datacon 2200 evo has programmable bond force from 0.5 N to 75 N. The Besi Datacon 2200 evo can process die attach at up to 7,000 UPH per module, flip chip with dipping at up to 2,500 UPH per module, and flip chip without dipping at up to 3,200 UPH per module. The Besi Datacon 2200 evo has a standard bond head with 0° to 360° rotation, and an optional heated bond head up to 450°C. The Besi Datacon 2200 evo also offers UV curing at 365 nm and 405 nm.^[1]

Applications

The Besi Datacon 2200 evo is intended for die attach, flip chip, and multi-chip applications. The Besi Datacon 2200 evo supports MCM, SiP, and hybrids. The Besi Datacon 2200 evo can handle die attach die sizes from 0.17 mm to 50 mm and flip chip die sizes from 0.5 mm to 50 mm. The Besi Datacon 2200 evo supports wafer sizes from 4 inches to 12 inches and substrate working range up to 13 inches by 8 inches, or 325 mm by 200 mm. The Besi Datacon 2200 evo supports FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak, JEDEC tray, and odd-shape substrates.^[1]

What do the numbers mean?

Power & electrical2

Power supply: 3 x 400 v^[3]
U nominal: 3 x 400 V^[3]

Wafer handling3

Wafer size: 4" - 12" (SEMI M1)^[1]
Substrate working range: 13" x 8" (325 mm x 200 mm)^[1]
Wafer handling: 12" wafer handling^[1]

Optics & imaging2

UV curing wavelengths: 365 nm & 405 nm^[1]
UV Curing: 365 nm & 405 nm^[1]

Performance10

X/Y placement accuracy: ±10 µm @ 3s^[1]
Theta placement accuracy: ±0.15° @ 3s^[1]
Throughput (die attach): up to 7,000 UPH/module^[1]
Throughput (flip chip with dipping): up to 2,500 UPH/module^[1]
Throughput (flip chip without dipping): up to 3,200 UPH/module^[1]
Product type: High-accuracy multi-chip die bonder^[1]
X/Y placement accuracy: ± 10 µm @ 3 Sigma^[1]
Die attach throughput: up to 7,000 UPH/module^[1]
Flip chip throughput with dipping: up to 2,500 UPH/module^[1]
Flip chip throughput without dipping: up to 3,200 UPH/module^[1]

Dimensions & facilities2

Machine dimensions (LxDxH): 1,160 mm x 1,225 mm x 1,750 mm^[1]
Weight: 1,300 kg^[1]

Configuration & options18

Dual Head^[2]
Bond force: 0.5N to 75N programmable^[1]
Number of working heads: up to 4^[1]
Die size (die attach): 0.17 mm - 50 mm^[1]
Die size (flip chip): 0.5 mm - 50 mm^[1]
Die thickness: >50 µm (thinner on request)^[1]
Uptime: > 98 %^[1]
Yield: > 99.95 %^[1]
Heated bond head temperature: up to 450°C (optional)^[1]
UPH (Die attach): up to 7,000 UPH/module^[1]
UPH (Flip Chip with dipping): up to 2,500 UPH/module^[1]
UPH (Flip Chip without dipping): up to 3,200 UPH/module^[1]
Bond head rotation: 0° - 360°^[1]
Frame size: FF070, FF105, FF108, FF123; automatic change^[1]
Head configuration: Dual Head^[2]
Applications: Die attach, flip chip, multi-chip^[1]
Integrated dispenser: Yes^[1]
Automatic tool changer: Yes^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
Datacon 2200 evo plus	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[1]
Datacon 2200 evo hF	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[1]
Datacon 2200 evo hS	—	—	Listed under Multi Module Attach products on Besi website; no detailed specifications provided in these sources.	besi.com^[1]
Datacon 2200 evo advanced	—	—	New gantry & controller system, new vision and camera generation. X/Y placement accuracy: ±3 µm @ 3s, theta accuracy: ±0.07° @ 3s, bond force: 0.5N to 25N closed loop, die attach size: 0.15 mm - 30 mm, flip chip size: 0.5 mm - 30 mm. UV curing with up to 2,000 mW/cm² (365/405 nm).	besi.com^[11]

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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Finetech Lambda— Same function class: Packaging & Bonding, nullCompare in depthsource^[12]
ASM LinDA— Same function class: Packaging & Bonding, nullCompare in depthsource^[13]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power supply3 x 400 v^[3]
U nominal3 x 400 V^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Besi Datacon 2200 evo?

The Besi Datacon 2200 evo is a high-accuracy multi-chip die bonder for die attach and flip chip applications.^[1]

What die sources and placement targets does the Besi Datacon 2200 evo support?

The Besi Datacon 2200 evo can pick die from wafer, waffle pack, gel pack, and feeder inputs. The Besi Datacon 2200 evo can place die to carrier, boat, substrate, PCB, lead frame, and wafer outputs.^[1]

What placement accuracy does the Besi Datacon 2200 evo provide?

The Besi Datacon 2200 evo provides X/Y placement accuracy of ± 10 µm at 3 Sigma and theta placement accuracy of ± 0.15° at 3 Sigma.^[1]

What process options are available on the Besi Datacon 2200 evo?

The Besi Datacon 2200 evo supports hot and cold processes including epoxy, soldering, and thermo-compression. The Besi Datacon 2200 evo also supports epoxy writing, stamping, flux dipping, optional heated bond head operation up to 450°C, and UV curing at 365 nm and 405 nm.^[1]

Not publicly documented

The following facts about the 2200 EVO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 EVO are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2200 EVO are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 EVO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 EVO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 EVO are on record.
Answerable by: an OEM parts catalog or a service engineer