Waferpedia

Comparison ledger

200 ACUversus2300 Flex 45

Axcelis 200 ACU, Lam Research 2300 Flex 45, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
2300 Flex 45Lam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300
Specifications
ConfigurationParts Machine[1]Metal HP MWS[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]2300 Flex 45[5]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Etcher[5]
Wafer configuration8 inch[2]—
3 Chambers—Insulating Film / Metal / Ashing[5]
Make—Lam[5]
Chambers—3 chambers[5]
Process coverage—Insulating film / Metal / Ashing[5]
Gases used for insulating film—C4F8, CF4, CH3F[5]
Gases used for metal—Cl2, BCl3[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]inventory listing