Waferpedia

Comparison ledger

200 PCUversusNV 10 160 Ion

Axcelis 200 PCU, Axcelis NV 10 160 Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size—Multiple wafer disks
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis NV 10 160 Ion
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
Max. Implant Energy—160 keV[4]
Beam Current Range—0.5-8 mA[4]
End Station—Manual Load[4]
Automatic Wafer Handling—No AT4[4]
Source—Standard[4]
Gas Box—4 ELB Strings[4]
Vacuum—Dry Pump + Diffusion Pump[4]
Control System—Standard Console[4]
Wafer size—Multiple wafer disks[4]
Vacuum System—Dry Pump + Diffusion Pump[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing