Comparison ledger
Besi 2200 APM, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2200 APMBesi | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Besi | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | Logitech 1 WBS 1 Wafer Substrate |
| Cited variants |
| — |
| Specifications | ||
| Phase | 3 Phase[1] | — |
| Voltage | 400V[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Equipment type | Bonder[2] | — |
| Make | Besi / Datacon[3] | — |
| Model | 2200 APM[3] | — |
| Machine type | High-accuracy multi-chip die bonder[4] | — |
| Application | Semiconductor packaging and bonding operations[2] | — |
| Applications | Die attach and flip chip applications[5] | — |
| Electrical | 3 Phase, 400V, 50/60 Hz[2] | — |
| Vintage | 2001[4] | — |
| Wafers handled | 12-inch wafers[5] | — |
| Integrated dispenser | Included[4] | — |
| Tool changer | Automatic tool changer[4] | — |
| Tooling | Application specific tooling[4] | — |
| Wafer Size | — | 6 inch[6] |
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