Besi
2200 APM
The Besi / Datacon 2200 APM is a bonder. The Besi / Datacon 2200 APM has model designation 2200 APM. The Besi / Datacon 2200 APM is made by Besi / Datacon.[1]
What it is
How it works
The Besi 2200 APM Die Attach Flip Chip configuration includes a vacuum plate. The Datacon 2200 is equipped with an integrated dispenser, wafer handling, an automatic tool changer, and application specific tooling. The Datacon 2200 high-accuracy multi-chip die bonder provides die attach as well as flip chip capability.[9][8]
Where it fits in the process flow
The Besi / Datacon 2200 APM is used in the back-end portion of semiconductor manufacturing where individual devices are prepared for assembly into packages. Bonding equipment sits after device fabrication and before final packaged parts move onward to downstream assembly and test steps.[7]
Applications
General reference — not yet source-verifiedPackaging and bonding equipment is used for semiconductor assembly tasks that require precise placement and attachment of dies, leads, or package elements. The equipment class supports package build steps where device parts must be attached accurately to carriers or interconnect structures.
What do the numbers mean?
Power & electrical4
- 50/60 Hz[2]
Wafer handling1
Performance1
Configuration & options10
- DA 300 Module included[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2200 APM+ | — | 2004 | Listed with 3 Phase - 400V - 50/60 Hz and DA 300 Module included. | Equipment inventory listing[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of machine is the Besi / Datacon 2200 APM?
The Besi / Datacon 2200 APM is a bonder used in semiconductor packaging and bonding operations.[7]
What packaging processes does the Besi 2200 APM support?
The Besi 2200 APM supports die attach and flip chip applications.[9]
Does the Besi 2200 APM include a vacuum plate in the die attach flip chip configuration?
The Besi 2200 APM Die Attach Flip Chip configuration includes a vacuum plate.[9]
Not publicly documented
The following facts about the 2200 APM are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 APM are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2200 APM are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 APM are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 APM is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 APM are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]waferpedia.com — waferpedia.comwaferpedia.com
- [8]ibesmt.com — ibesmt.comibesmt.com
- [9]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 19, 2026.
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