Waferpedia

Comparison ledger

DC 2200 EVOversus101-149-053 Gold Booster

Besi DC 2200 EVO, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMBesiBranson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBesi DC 2200 EVOBranson 101-149-053 Gold Booster
Specifications
ConfigurationSingle head[1]1:1.5[4]
TypeDie bonder[2]Gold Booster[5]
CategoryPackaging & Bonding[3]—
ModelDC 2200 EVO[1]101-149-053[5]
MakeBesi / Datacon[1]—
Manufacturer—Branson[5]
Operating frequency—20 kHz[6]
Gain—1:1.5[5]
Mounting thread—1/2-20[6]
Length—5.4 in[6]
Gain ratio—1:1.5[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]nextdayautomation.comnextdayautomation.com