Besi
DC 2200 EVO
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA die bonder places and attaches individual semiconductor dies onto a chosen substrate or package assembly.
A single-head die bonder handles one bonding head for pickup, placement, and attachment operations in a sequential handling flow.
Applications
General reference — not yet source-verifiedThe Besi DC 2200 EVO is used for semiconductor package assembly that requires die attachment.
The Besi DC 2200 EVO is suited to production tasks that place discrete dies onto package substrates or related carriers.
What do the numbers mean?
Configuration & options5
- Single head[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DC 2200 EVO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DC 2200 EVO are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DC 2200 EVO are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DC 2200 EVO are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DC 2200 EVO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DC 2200 EVO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 13, 2026.
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