Comparison ledger
Blanchard 18 D Surface, Disco DAD641, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DAD641Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DAD641 |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | — |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[2] | — |
| Model | 18 D[2] | — |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[2] | — |
| Tool type | — | Dicing saw[4] |
| Location | — | Backend Lab[4] |
| Tool name | — | Disco DAD641[5] |
| Blade thickness options | — | 0.250 mm and 0.090 mm[6] |
| Tape thickness options | — | 130 μm (blue tape) and 160 μm (UV tape)[6] |
| Substrate dicing capability | — | 5×5 mm2 pieces[7] |
| Use | — | Wafer dicing[5] |
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