Disco
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The Disco DAD641 is a dicing saw used for wafer dicing. The Disco DAD641 can dice wafers into small substrates, such as 5×5 mm2 pieces.[1]
Plate 01DAD641 alignment 1
Plate 02DAD641 wafer 2
A dicing saw is a wafer singulation tool used to cut processed substrates into individual dies or chips. Dicing saws are part of backend microfabrication and packaging work, where patterned wafers or other substrates are separated after earlier device-forming steps are complete.
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The Disco DAD641 is a dicing saw.[3]
The following facts about the DAD641 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD641 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD641 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD641 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD641 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD641 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.
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