Disco
DAD641
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Plate 01DAD641 alignment 1
NTCRaymondWatch on YouTubePlate 02DAD641 wafer 2
NTCRaymondWatch on YouTube
What it is
How it works
General reference — not yet source-verifiedDicing saws use a rotating, thin diamond-impregnated blade to cut through semiconductor substrates along defined street lines between dies.
Where it fits in the process flow
General reference — not yet source-verifiedThe DAD641 is a back-end-of-line (BEOL) or assembly tool used after all front-end wafer fabrication steps are complete.
The dicing process separates individual device die from the wafer prior to further packaging steps such as die attach, wire bonding, or encapsulation.
Applications
The DAD641 has been used in research applications to prepare silicon substrates for near-field radiative heat transfer experiments, where wafers were diced into small square samples.[3]
What do the numbers mean?
Configuration & options3
What replaced it?
Related models
- siblingDisco DAD3220— Listed on the same equipment page under packaging equipment.source[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of substrates can the DAD641 dice?
The DAD641 can dice silicon, glass, quartz, and sapphire substrates, based on available blade types for these materials.[4]
What tape types are used with the DAD641 for dicing?
The DAD641 can use blue tape (130 micrometers thickness) or UV tape (160 micrometers thickness), the latter requiring UV exposure for release.[4]
How is the wafer protected during dicing on the DAD641?
The device side can be protected with photoresist, blue tape, or UV tape during the dicing process.[4]
Not publicly documented
The following facts about the DAD641 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD641 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD641 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD641 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD641 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD641 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [2]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [3]https://arxiv.org/pdf/2003.03282 — arxiv.orgarxiv.org
- [4]Request Equipment Training or Service | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
Last updated Aug 13, 2026.
