Waferpedia

Comparison ledger

18 D SurfaceversusDFG 8560

Blanchard 18 D Surface, Disco DFG 8560, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—Wafer Equipment
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFG
Specifications
Voltage416 V[1]200V[4]
Phase3 Phase[1]3 Phase[4]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]Disco[4]
Model18 D[2]DFG 8560[7]
Asset #153970[1]—
Power416 V, 3 phase[2]200 VAC, 3 phase, 50/60 Hz, 57 A[5]
Configuration—3 Wire + 2 Ground[4]
Spindle Type—Air Bearings[4]
External Cooling—Water Cooled[4]
Frequency—50 / 60 Hz[5]
Full Load Amps—57 A[5]
Maximum workpiece size—300 mm[6]
Number of spindles—2[6]
Spindle power (Z1-Z3)—4.8 kW[6]
Spindle speed (Z1-Z3)—1,000 - 4,000 min⁻¹[6]
Number of work tables—3[6]
Dimensions (WxDxH)—1,400 x 3,322 x 1,800 mm[6]
Weight—approx. 4,000 kg[6]
Full load amperage—57 A[4]
Machine type—Grinder[4]
Wiring—3 Wire + 2 Ground[4]
Chiller—Disco DTU 152[4]
OEM—Disco[4]
Category—Dicing & Grinding[6]
Automation—Fully automatic[6]
Spindle count—2[6]
Work table count—3[6]
Vintage—2011[4]
Wafer size—Wafer Equipment[7]
- Vintage—2019[7]
Equipment type—Grinder[4]
Dimensions (W x D x H)—1,400 x 3,322 x 1,800 mm[6]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org
  7. [7]dealer listingwotol.com