Comparison ledger
Blanchard 18 D Surface, Disco DFL 7340 Stealth Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DFL 7340 |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | — |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[2] | — |
| Model | 18 D[2] | DFL7340[5] |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[2] | — |
| Configuration | — | Power supply removed[4] |
| OEM | — | Disco[5] |
| Process area | — | Packaging[5] |
| Purpose | — | Laser Stealth dicing of Si wafers[6] |
| Applications field | — | Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[6] |
| Wavelength | — | 1342 nm[5] |
| Maximum sample diameter | — | 200 mm[5] |
| Wafer size | — | 200 mm or smaller[6] |
| Compatible materials | — | Si wafers only[5] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[5] |
| Position accuracy | — | 3 µm[6] |
| Feeding speed | — | 1.0–1000 mm/s[6] |
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