Disco
DFL 7340 Stealth Laser Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DFL 7340 Stealth Laser Dicing is a laser dicing system. The Disco DFL 7340 Stealth Laser Dicing is dedicated to dicing silicon wafers only. The Disco DFL 7340 Stealth Laser Dicing has a maximum sample diameter of 200 mm.[1][2]
What it is
The Disco DFL 7340 Stealth Laser Dicing system is a wafer dicing machine in the dicing and grinding class. The DFL 7340 model is a laser dicing system from Disco.[3][4]
How it works
Where it fits in the process flow
Applications
The DFL 7340 is used for contact-less dicing of silicon wafers. The DFL 7340 is applied to silicon wafer processing for PICs, MEMS, and BIO-MEMS.[2]
The DFL 7340 is dedicated to silicon wafers only. The DFL 7340 supports wafers at or below 200 mm in sample diameter and allows dicing from the topside or from the backside through tape.[1][2]
The DFL 7340 requires a smooth, mirror-polished dicing street at the laser incidence surface. The DFL 7340 also requires a metal-free street width centered on the dicing street.[1][2]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Power supply removed
What do the numbers mean?
Power & electrical1
- Power supply removed[3]
Wafer handling4
- Applications field
- Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[2]
Optics & imaging1
Performance1
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationPower supply removed[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFL 7340 Stealth Laser Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7340 Stealth Laser Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL 7340 Stealth Laser Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL 7340 Stealth Laser Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DFL 7340 Stealth Laser Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFL 7340 Stealth Laser Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [2]c2mi.ca — c2mi.cac2mi.ca
- [3]Inventory photo
- [4]DFL 7340 Stealth Laser Dicing — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [5]DISCO DFL-7340 Laser Dicing Saw for sale — fabsurplus.comfabsurplus.com
Last updated Oct 13, 2026.
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