Waferpedia

Comparison ledger

18 D SurfaceversusDTG 8460 Wafer Backside

Blanchard 18 D Surface, Disco DTG 8460 Wafer Backside, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DTG 8460
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Configuration—Includes DTU 1550[4]
Chuck table for 12—, and 8" is possible[4]
Each spindle has 2 height gauge—inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[4]
Machine type—Wafer backside grinder[5]
Wafer size—12 inch[5]
Accessory—Includes DTU 1550[4]
Chuck table—For 12", and 8" is possible[5]
Robot picker—For 12", and 8" is possible[5]
Spinner table—For 12", and 8" is possible[5]
Height gauge—Each spindle has 2 height gauge: inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[5]
Includes—DTU 1550[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com