Disco
DTG 8460 Wafer Backside
What is it?
What do the numbers mean?
Wafer handling2
- Robot picker for 12", and 8" is possible[1]
Dimensions & facilities1
- Each spindle has 2 height gauge
- inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[1]
Configuration & options2
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the DTG 8460 Wafer Backside are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8460 Wafer Backside are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DTG 8460 Wafer Backside are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DTG 8460 Wafer Backside are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8460 Wafer Backside are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8460 Wafer Backside is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Jul 29, 2026.
