Disco
DTG 8460 Wafer Backside
What it is
General reference — not yet source-verifiedThe Disco DTG 8460 Wafer Backside is a dicing and grinding machine for wafer backside processing.
How it works
Where it fits in the process flow
General reference — not yet source-verifiedWafer backside grinding belongs in back-end or post-front-end wafer processing, where wafer thickness control and backside preparation support later dicing and assembly operations.
Applications
General reference — not yet source-verifiedWafer backside grinding is used in semiconductor manufacturing for wafer thinning and backside preparation before downstream singulation and packaging.
What do the numbers mean?
Wafer handling6
- Robot picker for 12", and 8" is possible[1]
Dimensions & facilities2
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the main purpose of a wafer backside grinder?General reference — not yet source-verified
The main purpose is to reduce the thickness of a semiconductor wafer by grinding away material from its backside, preparing the wafer for dicing and packaging.
How is the front side of the wafer protected during backside grinding?General reference — not yet source-verified
The patterned front side is protected by an applied protective tape or by mounting the wafer on a carrier before the backside is ground.
What quality attributes are important for backside grinding?General reference — not yet source-verified
Important attributes include final thickness uniformity, surface finish, low subsurface damage, and minimal chipping at the wafer edge.
What are the typical process stages in this equipment class?General reference — not yet source-verified
Typical stages include wafer loading and alignment, coarse grinding, fine grinding, in-process thickness measurement, cleaning, and drying before the wafer exits the system.
Not publicly documented
The following facts about the DTG 8460 Wafer Backside are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8460 Wafer Backside are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DTG 8460 Wafer Backside are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DTG 8460 Wafer Backside are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8460 Wafer Backside are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8460 Wafer Backside is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 12, 2026.
Compare with similar tools
View all →
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
The Blanchard 18 D Surface is a surface grinder used in Dicing & Grinding applications.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
