Comparison ledger
Blanchard 20 36 Surface, Disco DFG 8540 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | DFG 8540 BackDisco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco DFG |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | 6" / 8" Universal Table for IGBT Si[3] |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Type | surface grinder[1] | — |
| Application | dicing and grinding[2] | — |
| Magnetic chuck control | Electro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Condition note | low hours[1] | — |
| Voltage | — | 200 VAC[3] |
| Phase | — | 3 Phase[3] |
| Full Load | — | 54 A[3] |
| Make | — | Disco[3] |
| Model | — | DFG 8540[3] |
| Equipment type | — | Back Grinder[3] |
| Wafer sizes | — | 6, 8 inch[3] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[4] |
| Supported workpiece size | — | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[4] |
| Grinding wheels | — | Φ200 mm Diamond Wheel[4] |
| Spindle rated output | — | 4.2 kW[4] |
| Rotation speed range | — | 1,000 to 7,000 min-1[4] |
| Equipment dimensions (W × D × H) | — | 1,200 × 2,670 × 1,800 mm[4] |
| Equipment weight | — | Approx. 3,100 kg[4] |
| Processing capability | — | Large diameter grinding and thin-finish grinding[5] |
| Thin wafer handling | — | Ultra-thin wafer handling to 100 µm and less[5] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →