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Disco

DFG 8540 Back

Dicing & GrindingDisco DFG family
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The Disco DFG 8540 Back Grinder is a fully automatic grinder. The Disco DFG 8540 Back Grinder supports Φ8 inch workpieces, with Φ4, 5, 6, and 8 inch support when a universal chuck table is used. The Disco DFG 8540 Back Grinder uses anomalous in-feed grinding with wafer rotation.[1]

DFG 8540 Back — Inventory photo
Fig. 01DFG 8540 BackInventory photo[2]

What it is

The Disco DFG 8540 is a fully automatic grinder used for wafer thinning and back grinding.[1]

How it works

The DFG 8540 uses an anomalous in-feed grinding method with wafer rotation.[1]

The DFG 8540 uses a two-axis, three-chuck-table architecture.[1]

Where it fits in the process flow

The DFG 8540 supports wafer thinning for wafers up to 200 mm diameter.[1][9]

The DFG 8540 can be integrated with DISCO's Dicing Before Grinding system and with polishers for in-line processing solutions.[1]

Applications

The DFG 8540 is used for thin wafer grinding and wafer thinning.[1]

The DFG 8540 is specified for IGBT silicon and for large-diameter grinding and thin-finish grinding.[2][9]

What do the numbers mean?

Power & electrical4

Voltage
200 VAC[2]
Accurate?
Phase
3 Phase[2]
Accurate?
50/60 Hz[2]
Accurate?
Spindle rated output
4.2 kW[1]
Accurate?

Wafer handling5

Wafer sizes
6, 8 inch[2]
Accurate?
Grinding method
Anomalous in-feed grinding with wafer rotation[1]
Accurate?
Supported workpiece size
Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[1]
Accurate?
Conventional two-spindle, three-chuck design[9]
Accurate?
Thin wafer handling
Ultra-thin wafer handling to 100 µm and less[9]
Accurate?

Dimensions & facilities2

Equipment dimensions (W × D × H)
1,200 × 2,670 × 1,800 mm[1]
Accurate?
Equipment weight
Approx. 3,100 kg[1]
Accurate?

Configuration & options8

6" / 8" Universal Table for IGBT Si[2]
Accurate?
Full Load
54 A[2]
Accurate?
Make
Disco[2]
Accurate?
Model
DFG 8540[2]
Accurate?
Equipment type
Back Grinder[2]
Accurate?
Grinding wheels
Φ200 mm Diamond Wheel[1]
Accurate?
Rotation speed range
1,000 to 7,000 min-1[1]
Accurate?
Processing capability
Large diameter grinding and thin-finish grinding[9]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage200 VAC[2]
  • Phase3 Phase[2]
  • Configuration50/60 Hz[2]
  • Spindle rated output4.2 kW[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the DFG 8540 support?

The DFG 8540 supports a wafer size of Φ8 inch, and the universal chuck table allows Φ4, 5, 6, and 8 inch workpieces.[1]

What grinding method does the DFG 8540 use?

The DFG 8540 uses anomalous in-feed grinding with wafer rotation.[1]

Can the DFG 8540 be used with other processing systems?

The DFG 8540 can be integrated with DISCO's Dicing Before Grinding system and with polishers for in-line processing solutions.[1]

Not publicly documented

The following facts about the DFG 8540 Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 8540 Back are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DFG 8540 Back are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DFG 8540 Back are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFG 8540 Back are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFG 8540 Back is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (9)Every fact above is drawn from these public sources
  1. [1]disco.co.jp — disco.co.jpdisco.co.jp
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]Inventory photo
  7. [7]Inventory photo
  8. [8]Inventory photo
  9. [9]s3-alliance.com — s3-alliance.coms3-alliance.com
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Last updated Oct 13, 2026.

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