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Comparison ledger

20 36 SurfaceversusDFG 8560

Blanchard 20 36 Surface, Disco DFG 8560, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—Wafer Equipment
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFG
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]3 Wire + 2 Ground[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Typesurface grinder[1]—
Applicationdicing and grinding[2]—
Magnetic chuck controlElectro-Matic Neutrol II Magnetic Chuck Control[2]—
Condition notelow hours[1]—
Phase—3 Phase[3]
Voltage—200V[3]
Spindle Type—Air Bearings[3]
External Cooling—Water Cooled[3]
Frequency—50 / 60 Hz[4]
Full Load Amps—57 A[4]
Maximum workpiece size—300 mm[5]
Number of spindles—2[5]
Spindle power (Z1-Z3)—4.8 kW[5]
Spindle speed (Z1-Z3)—1,000 - 4,000 min⁻¹[5]
Number of work tables—3[5]
Dimensions (WxDxH)—1,400 x 3,322 x 1,800 mm[5]
Weight—approx. 4,000 kg[5]
Full load amperage—57 A[3]
Machine type—Grinder[3]
Wiring—3 Wire + 2 Ground[3]
Chiller—Disco DTU 152[3]
OEM—Disco[3]
Model—DFG 8560[6]
Category—Dicing & Grinding[5]
Automation—Fully automatic[5]
Spindle count—2[5]
Work table count—3[5]
Power—200 VAC, 3 phase, 50/60 Hz, 57 A[4]
Vintage—2011[3]
Wafer size—Wafer Equipment[6]
- Vintage—2019[6]
Make—Disco[3]
Equipment type—Grinder[3]
Dimensions (W x D x H)—1,400 x 3,322 x 1,800 mm[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org
  6. [6]dealer listingwotol.com