Comparison ledger
Blanchard 20 36 Surface, Disco DFL 7340 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco DFL 7340 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Type | surface grinder[1] | — |
| Application | dicing and grinding[2] | — |
| Magnetic chuck control | Electro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Condition note | low hours[1] | — |
| Phase | — | 3 phase[3] |
| Tool type | — | laser dicing saw[3] |
| Power | — | 3 phase[3] |
| Wafer sizes | — | 6 inch[4] |
| Process wavelength | — | IR[5] |
| Wafer diameter | — | 200mm wafers or smaller (6in, 4in, 3in, coupon, wafer quarter)[5] |
| Maximum wafer thickness | — | up to 1.5 mm[5] |
| Multi-project wafers | — | MPW dicing capabilities[5] |
| Back side alignment | — | IR camera[5] |
| Feeding speed | — | 1.0 – 1000 mm/s[5] |
| Position accuracy | — | 3µm[5] |
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