Disco
DFL 7340 Laser Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
The Disco DFL7340 performs laser stealth dicing of silicon wafers in a fully automated mode. The Disco DFL7340 uses an IR process wavelength. The Disco DFL7340 has an IR camera for back side alignment. The Disco DFL7340 has X-axis and Y-axis feeding speed of 1.0 to 1000 mm/s. The Disco DFL7340 has position accuracy of 3 µm.[4]
Applications
The Disco DFL7340 is used for contact-less dicing of silicon wafers. The Disco DFL7340 is applied in PICs, MEMS, BIO-MEMS, and semiconductor non-wet dicing. The Disco DFL7340 handles 200 mm wafers or smaller, including 6 inch, 4 inch, 3 inch, coupon, and wafer quarter formats. The Disco DFL7340 supports wafers up to 1.5 mm thick. The Disco DFL7340 has multi-project wafers dicing capabilities.[4]
What do the numbers mean?
Power & electrical2
Wafer handling4
Optics & imaging3
Performance1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What material does the Disco DFL7340 dice?
The Disco DFL7340 is used for laser stealth dicing of silicon wafers.[4]
Not publicly documented
The following facts about the DFL 7340 Laser Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7340 Laser Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL 7340 Laser Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL 7340 Laser Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL 7340 Laser Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL 7340 Laser Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]c2mi.ca — c2mi.cac2mi.ca
Last updated Oct 20, 2026.
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