Comparison ledger
Blanchard 20 36 Surface, Takatori MWS-SiC12F, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | MWS-SiC12FTakatori |
|---|---|---|
| OEM | Blanchard | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Takatori MWS-SiC12F |
| Cited variants | — |
|
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[2] | — |
| Product line | — | MWS (Multi Wire Saw)[1] |
| Machine type | — | multi wire saw[1] |
| Capable materials | — | SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and other hard brittle material[1] |
| Variable processing conditions | — | thin wire, high wire tension, fast wire running, extra-long time slicing process[1] |
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