Takatori

The Takatori MWS-SiC12F is a multi wire saw (MWS) machine produced by Takatori Corporation. Multi wire saws are designed to slice ingots of hard and brittle materials into multiple thin wafers simultaneously.[1]
Multi wire saws employ a continuously moving wire web wound around multiple grooved rollers to create a set of parallel cutting channels. An abrasive slurry, typically containing diamond particles, is applied to the wire to enhance material removal. The workpiece is slowly fed into the wire web, and the combination of wire motion and slurry abrasion erodes the material along the cutting planes, forming multiple wafers in a single pass.
Process applications and technology nodes documented for this tool.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MWS-SiC12F | — | — | — | takatori-g.co.jp[1] |
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The following facts about the MWS-SiC12F are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS-SiC12F are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MWS-SiC12F are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MWS-SiC12F are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MWS-SiC12F is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MWS-SiC12F are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 9, 2026.
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