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Comparison ledger

DCC 256 E MP 550versus1000 Hot Plate

Blue M DCC 256 E MP 550, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMBlue MCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M DCC 256CEE 1000 Hot Plate
Specifications
Phase3 phase[1]—
Configurationwith Watlow programmable profile controller[1]4"[3]
ManufacturerBlue M[2]—
ModelDCC 256 E MP 550[1]—
Equipment typeOven[2]—
ControllerWatlow programmable profile controller[1]—
Power & electrical3 phase[2]—
Type—Hot Plate[3]
Wafer Size—4 inch[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing