CEE
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A hot plate is a semiconductor processing tool used to bake wafers during photoresist processing. Hot plates provide controlled heating for steps such as soft bake, post-exposure bake, and hard bake.
A semiconductor hot plate typically consists of a heated chuck that supports the wafer. Temperature is controlled by a controller to achieve precise bake profiles. Some hot plates include a vacuum system to hold the wafer flat during heating.
In photolithography, hot plates are used to remove solvent from photoresist after spin coating, to activate photoacid generators after exposure, and to cross-link the resist in the final bake. The hot plate step is placed between coat and develop, or after develop for hard bake.
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The CEE 1000 is a hot plate.[1]
The following facts about the 1000 Hot Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1000 Hot Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1000 Hot Plate are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1000 Hot Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1000 Hot Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1000 Hot Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 14, 2026.