Comparison ledger
Branson 101-149-053 Gold Booster, Hesse & Knipps Bondjet LSB959, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | Bondjet LSB959Hesse & Knipps |
|---|---|---|
| OEM | Branson | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Hesse & Knipps Bondjet LSB959 |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | Fully automatic heavy wire bonder[4] |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Machine type | — | Fully automatic heavy wire bonder[4] |
| Function | — | Thermosonic function[4] |
| Product line | — | Bondjet[4] |
| Laser source | — | IR fiber laser[5] |
| Laser power | — | Up to 130 W[5] |
| Bondtool tip temperature | — | 400-500 °C[5] |
| Interface temperature | — | 150-200 °C[5] |
| Frequency | — | 60 kHz[5] |
| Wire diameter | — | Cu: 300 μm – 500 μm[5] |
| Working area X | — | 370 mm[5] |
| Working area Y | — | 560 mm[5] |
| Working area Z | — | 42 mm[5] |
| P-rotation | — | 440°[5] |
| Footprint | — | 805 x 1634 x 1912 mm[5] |
| Weight | — | ca. 1300 kg[5] |
| Power supply | — | 230V AC[5] |
| Connectivity | — | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air, vacuum, process gas[5] |
| Operation modes | — | Fully automatic or manual[5] |
| Process modes | — | Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[5] |
| Laser safety class | — | Laser class 1[5] |
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