Comparison ledger
Branson 101-149-053 Gold Booster, Hesse & Knipps BJ 959 Heavy, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | BJ 959 HeavyHesse & Knipps |
|---|---|---|
| OEM | Branson | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Hesse & Knipps (H&K) BJ 959 Heavy |
| Specifications | ||
| Configuration | 1:1.5[1] | Hesse RBK 03 X 2277[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | Heavy wire bonder[4] |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Voltage | — | 230 V AC[4] |
| Phase | — | 1 Phase[4] |
| Bonding method | — | Wedge bonder[5] |
| Machine type | — | Fully automatic heavy wire wedge bonder[6] |
| Operation mode | — | Fully automatic machine or manual operation[6] |
| Wire size | — | 50 μm – 600 μm (2 mil – 24 mil) for Al, Cu, AlCu[6] |
| Copper wire size | — | 50 to 600 µm[5] |
| Ribbon size | — | 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)[6] |
| Ribbon size (semiconductor directory) | — | 250 x 25 µm up to 2000 x 400 µm[5] |
| Working area X | — | 370 mm[6] |
| Working area Y | — | 560 mm[6] |
| Working area Z | — | 42 mm[6] |
| Motorized X and Y travel | — | 370 x 560 mm[5] |
| Motorized Z travel | — | 42 mm[5] |
| P-rotation | — | 440°[6] |
| Footprint (W x D x H) | — | 805 x 1634 x 1912 mm[6] |
| Overall dimensions | — | 805 x 1634 x 1912 mm[5] |
| Weight | — | ca. 1300 kg[6] |
| Net weight | — | 1300 kg[5] |
| Power supply | — | 230V AC[6] |
| Power supply (semiconductor directory) | — | 230V AC[5] |
| Media connectivity | — | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, Compressed air (CDA clean, dry air), Vacuum[6] |
| Bondhead frequency | — | 60 kHz* for HBK heavy wire bondhead; 57 kHz* for RBK ribbon and RBK Copper bondheads (* exact range of frequencies on request)[6] |
| Bondhead wire range | — | 50 μm – 600 μm** for Al, Cu, AlCu (**depending on application and wire)[6] |
| Configuration (specific unit) | — | Hesse RBK 03 X 2277; Lexical M 50 Stereo Microscope with Adapter Arm[4] |
| Vintage (specific unit) | — | 2021[4] |
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