Hesse & Knipps
BJ 959 Heavy
What it is
General reference — not yet source-verifiedThe Hesse & Knipps BJ 959 Heavy is a heavy wire bonder for packaging and bonding work.
How it works
The BJ 959 supports ultrasonic wedge-wedge bonding. The BJ 959 uses one bondhead for wire sizes from 50 µm up to 600 µm. The BJ 959 supports aluminum, copper, and aluminum-copper wire, and it supports ribbon in the same material set.[3]
The BJ 959 includes pattern recognition, programmable bondforce control, wire clamp based loop-shape control, and process monitoring functions. The BJ 959 family also includes automated bondtool calibration, bondtool detection, wire spool detection, and integrated quality monitoring options.[3]
Where it fits in the process flow
The BJ 959 is intended for automated processing of large-sized substrates, chips, automotive applications, and battery-related applications. The BJ 959 also supports manual operation.[3]
The BJ 959 has a working area of 370 mm by 560 mm with a Z travel of 42 mm. The BJ 959 has a footprint of 805 mm by 1634 mm by 1912 mm and a weight of about 1300 kg. The BJ 959 uses 230 V AC power.[3][2]
Applications
The BJ 959 is used for large-sized substrates, chips, automotive applications, and batteries. The BJ 959 is also suited to power-module and battery-connection work in ultrasonic wire bonding contexts.[3]
What do the numbers mean?
Power & electrical5
Vacuum & pumping1
- Media connectivity
- Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, Compressed air (CDA clean, dry air), Vacuum[3]
Dimensions & facilities4
Configuration & options20
- Hesse RBK 03 X 2277[1]
- Lexical M 50 Stereo Microscope with Adapter Arm[1]
- Bondhead wire range
- 50 μm – 600 μm** for Al, Cu, AlCu (**depending on application and wire)[3]
- Configuration (specific unit)
- Hesse RBK 03 X 2277; Lexical M 50 Stereo Microscope with Adapter Arm[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage230 V AC[1]
- Configuration50/60 Hz[1]
- Power supply230V AC[3]
- Power supply (semiconductor directory)230V AC[2]
- Media connectivityGigabit-Ethernet (TCP/IP), USB-Ports, HDMI, Compressed air (CDA clean, dry air), Vacuum[3]
- Bondhead frequency60 kHz* for HBK heavy wire bondhead; 57 kHz* for RBK ribbon and RBK Copper bondheads (* exact range of frequencies on request)[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the BJ 959 Heavy are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 959 Heavy are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BJ 959 Heavy are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BJ 959 Heavy are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BJ 959 Heavy are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BJ 959 Heavy is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [3]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
Last updated Oct 13, 2026.
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