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Comparison ledger

101-149-053 Gold BoosterversusBondjet BJ 820 Rotary Bond Head

Branson 101-149-053 Gold Booster, Hesse & Knipps Bondjet BJ 820 Rotary Bond Head, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMBransonHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterHesse & Knipps (H&K) Bondjet BJ 820 Rotary Bond Head
Specifications
Configuration1:1.5[1]for RF360 EPCOS[4]
ManufacturerBranson[2]—
Model101-149-053[2]Bondjet BJ 820[4]
TypeGold Booster[2]Rotary bond head[5]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
OEM—Hesse & Knipps (H&K)[4]
Category—Packaging & Bonding[5]
Configuration / option—For RF360 EPCOS[5]
Bonding modes—Round wire and deep access ribbon and wire bonding[6]
Reported speed—Up to 7 wires/sec[6]
Work area—12 in x 16.1 in[6]
Footprint—720 x 1250 mm[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]circuitsassembly.comcircuitsassembly.com