Comparison ledger
Branson 101-149-053 Gold Booster, SUSS MicroTec ELD300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | ELD300SUSS MicroTec |
|---|---|---|
| OEM | Branson | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | SUSS MicroTec ELD300 |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Operation | — | Semi-automated[4] |
| Wafer Size | — | up to 300 mm[4] |
| Process | — | Excimer Laser-Assisted Debonding[4] |
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