SUSS MicroTec
ELD300
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ELD300 is a semi-automated system for excimer laser-assisted debonding. The ELD300 handles wafers up to 300 mm in size.[1]
Wafer size
300mm
Optics
Excimer Laser-Assisted Debonding[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Excimer Laser-Assisted Debonding
What do the numbers mean?
Wafer handling1
Optics & imaging1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum wafer size supported by the SUSS MicroTec ELD300?
The ELD300 is an automated system that supports wafers up to 300 mm.[1]
What type of processes is the ELD300 designed for?
The ELD300 is a laser processing system that supports laser ablation, laser-assisted debonding, and laser seed layer removal.[1]
Does the ELD300 include alignment capabilities?
Yes, the ELD300 includes alignment as part of its processing capabilities.[1]
Not publicly documented
The following facts about the ELD300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ELD300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ELD300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ELD300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ELD300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ELD300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Sep 22, 2026.
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