Comparison ledger
CEE 100 Spin, CEE 200 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 SpinCEE | 200 SpinCEE |
|---|---|---|
| OEM | CEE | CEE |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | CEE 200 |
| Specifications | ||
| Configuration | Volts 115[1] | 1 Phase[2] |
| Phase | — | 1 Phase[2] |
| Type | — | Spin Coater[2] |
| Model | — | 200[2] |
| Make | — | CEE[2] |
| Wafer Sizes | — | 8 inch[2] |
| Equipment type | — | Spin Coater[2] |
| Spin speed | — | 5000 rpm[3] |
| Substrate support | — | Flat substrates up to 200 mm or fragments[3] |
| Substrate thickness max | — | 12 mm[3] |
| Coating thickness | — | Uniform coating thickness up to 100 µm[3] |
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