CEE
200 Spin
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The CEE 200 is a spin coater. The CEE 200 supports 8 inch wafers.[1]
What it is
The CEE 200 Spin is a spin coater for semiconductor and microfabrication work.[1]
What do the numbers mean?
Wafer handling3
Configuration & options8
- 1 Phase[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- CEE X-Pro II Supplemental SOPSOPtamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrate sizes does the CEE Apogee 200 spin coater handle?
The CEE Apogee 200 spin coater handles flat substrates up to 200 mm or fragments, with a maximum substrate thickness of 12 mm.[2]
What spin speed does the CEE Apogee 200 spin coater achieve?
The CEE Apogee 200 spin coater has a spin speed of 5000 rpm.[2]
What coating thickness can the CEE Apogee 200 spin coater produce?
The CEE Apogee 200 spin coater yields uniform coating thicknesses up to 100 µm.[2]
What features does the CEE X-Pro II Auto-Developer Workstation include?
The CEE X-Pro II Auto-Developer Workstation is equipped with the CEE Apogee 200 Spin Developer, includes an HDPE spin bowl, an automatic drain separator, and an N2 purge system, and can dispense various developers followed by an H2O rinse and N2 drying.[3]
Not publicly documented
The following facts about the 200 Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 Spin are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 200 Spin are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 200 Spin are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 200 Spin are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 200 Spin is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]amolf.nl — amolf.nlamolf.nl
- [3]CEE X-Pro II Auto-Developer Workstation - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
Last updated Oct 19, 2026.
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