Comparison ledger
CEE 100, GCA AutoStep 200 AutoStep 200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | |
|---|---|---|
| OEM | CEE | GCA |
| Category | Lithography | Lithography |
| Wafer size | 6" | Ceramic high stability wafer chuck |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | GCA AutoStep 200 AutoStep 200 |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | — |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | Ceramic high stability wafer chuck[3] |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Configuration | — | 500nm with single patterning[3] |
| Manufacturer | — | GCA[3] |
| Model | — | AutoStep 200[3] |
| Wafer chuck | — | Ceramic high stability wafer chuck[3] |
| Process capability | — | 500nm with single patterning[3] |
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