Waferpedia

CEE

100

Lithography6"CEE 100 family
Research Quality: 40% complete
100 — nanofab.utah.edu
Fig. 01100nanofab.utah.edu[1]

Wafer size

6"

Gas delivery

Spray Developer[2]

What is it?

The sources identify the CEE 100 as a photolithography spin coater/developer tool. It is listed as a CEE 100 Spray Developer at Carnegie Mellon and as CEE 100 at Utah Nanofab, where it is described as accepting up to 6-inch wafers and supporting 10 programs with up to 10 steps including acceleration, speed, and time.

What can it run?

Process applications and technology nodes documented for this tool.

  • Photolithography
  • Lift-off resist processing

What do the numbers mean?

Wafer handling1

Accepts wafer size
up to 6" wafers[1]
Accurate?

Gas & chemistry1

Tool type
Spray Developer[2]
Accurate?

Configuration & options4

Programmable programs
10 programs[1]
Accurate?
Steps per program
up to 10 steps[1]
Accurate?
Programmable step parameters
Acceleration, Speed, Time[1]
Accurate?
Associated document
CEE Model 100CB Spinner.doc[1]
Accurate?
Interested in this tool?
Embed spec card

What replaced it?

  • siblingCEE 200XDListed in the same lithography spin coater group.source[3]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Tool typeSpray Developer[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 100 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 100 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 100 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 100 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 100 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]Equipment Page | Utah Nanofabnanofab.utah.edunanofab.utah.edu
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Last updated Jul 29, 2026.

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