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CEE

100

Lithography6"CEE 100 family
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The CEE 100 is a programmable spin coater used for photoresist application in photolithography. The CEE 100 accepts wafers up to 6 inches in diameter and supports 10 programs with up to 10 steps each. The CEE 100 also exists in a spray developer configuration and a CEE 100CB spinner/hotplate variant.[1][2]

100 — nanofab.utah.edu
Fig. 01100nanofab.utah.edu[1]

Wafer size

6"

Gas delivery

Spray Developer[2]

What it is

General reference — not yet source-verified

The CEE 100 is a spin coater used in photolithography. Spin coaters apply liquid photoresist or other coating fluids to a substrate by rotating the substrate so the liquid spreads into a thin film. Spin coaters are typically used in the coating stage before soft bake, alignment or exposure, development, and later pattern transfer steps.

How it works

The Cee Model 100 and 150 spinner module incorporates a stainless steel spin bowl. The spin bowl drain and exhaust connect through Teflon tubing to the main utilities bracket on the rear of the machine. The main drive spindle for the spin chuck is made of hardened corrosion-resistant alloy steel. The spindle is driven by a toothed belt and a servo motor. An integral optical encoder provides feedback for the closed-loop digital motor control system. The Cee Model 100 and 150 use a closed bowl design with an exhaust lid and a bottom exhaust port beneath the spin chuck.[4]

Where it fits in the process flow

General reference — not yet source-verified

Spin coating sits in the lithography sequence after substrate preparation and before exposure and development. A typical flow places adhesion promotion or dehydration before coating, then uses bake steps to condition the film, followed by patterning and resist development. The coated resist can then serve as a temporary imaging layer for etch, deposition, implantation, or lift-off steps.

Applications

General reference — not yet source-verified

Spin coaters are used to form uniform thin liquid films for photolithography and related microfabrication work. Common uses include coating positive or negative photoresists, lift-off stacks, and other solution-processed layers that must be spread evenly before later thermal or patterning steps.

  • Photolithography
  • Lift-off resist processing

What do the numbers mean?

Wafer handling3

Accepts wafer size
up to 6" wafers[1]
Accurate?
Wafer size
Up to 6 inches[1]
Accurate?
Wafer size
Accepts up to 6-inch wafers[1]
Accurate?

Gas & chemistry1

Tool type
Spray Developer[2]
Accurate?

Control & software1

Control parameters
Acceleration, Speed, Time[1]
Accurate?

Configuration & options8

Programmable programs
10 programs[1]
Accurate?
Steps per program
up to 10 steps[1]
Accurate?
Programmable step parameters
Acceleration, Speed, Time[1]
Accurate?
Associated document
CEE Model 100CB Spinner.doc[1]
Accurate?
Programs
10 programs each with up to 10 steps[1]
Accurate?
Equipment type
Spin coater[3]
Accurate?
Programming
10 programs; up to 10 steps per program[1]
Accurate?
Step parameters
Acceleration, speed, time[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
CEE 100CB——Includes a hotplate; available in table top and bench mount configurationsnanofab.ece.cmu.edu[2]
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What replaced it?

  • siblingCEE 200XD— Listed in the same lithography spin coater group.source[3]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Tool typeSpray Developer[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate size does the CEE 100 accept?

The CEE 100 accepts up to 6-inch wafers.[1]

How is the CEE 100 programmed?

The CEE 100 is programmable with 10 programs, each with up to 10 steps including acceleration, speed, and time.[1]

Not publicly documented

The following facts about the 100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 100 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 100 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 100 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 100 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 100 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.ece.cmu.edu — nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
  4. [4]https://cense.engr.uky.edu/sites/default/files/2026-06/100-150-service-manual.pdf — cense.engr.uky.educense.engr.uky.edu
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Last updated Oct 19, 2026.

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