Waferpedia

Comparison ledger

100versusSPP 300 Wafer

CEE 100, RECIF SPP 300 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEERECIF
CategoryLithographyLithography
Wafer size6"Front & Backside Wafer ID Reader (RFID)
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100RECIF SPP 300 Wafer
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Front & Backside Wafer ID Reader (RFID)[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Configuration—300 mm (12") FOUP Load Port[3]
Servicing Port—M / F Rear (Can Add 3rd LP Here)[3]
Status Lamp (Front & Rear)—Programmable[3]
Turn to Release EMO—Load Ports, M / F Rear[3]
Vacuum (House)—Optional Depending on LPS Used[3]
Power—110 VAC, 15 A, 3 Wire, 1 Phase, Freq 60 Hz[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing