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Comparison ledger

200 SpinversusGasonics L 3300

CEE 200 Spin, Lam Research Gasonics L 3300, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Gasonics L 3300Lam Research
OEMCEELam Research
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Lam Research Gasonics
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]—
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Parts machine[3]
Equipment typeSpin Coater[1]Asher[3]
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Wafer size—6 inch[3]
Part type—Parts machine[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com