Comparison ledger
CEE 200 Spin, Lam Research SEZ SP 223 Spin Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | SEZ SP 223 Spin ProcessingLam Research |
|---|---|---|
| OEM | CEE | Lam Research |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | Patented Wafer Chuck or Holding Device |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | Lam Research SEZ |
| Specifications | ||
| Phase | 1 Phase[1] | — |
| Type | Spin Coater[1] | — |
| Model | 200[1] | — |
| Make | CEE[1] | — |
| Wafer Sizes | 8 inch[1] | — |
| Configuration | 1 Phase[1] | 2 Chambers[3] |
| Equipment type | Spin Coater[1] | — |
| Spin speed | 5000 rpm[2] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[2] | — |
| Substrate thickness max | 12 mm[2] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[2] | — |
| Wafer size | — | Patented Wafer Chuck or Holding Device[3] |
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