Comparison ledger
CEE 200 Spin, Laurell WS-650-23 B Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | WS-650-23 B SpinLaurell |
|---|---|---|
| OEM | CEE | Laurell |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | Laurell WS-650-23 B Spin |
| Specifications | ||
| Phase | 1 Phase[1] | — |
| Type | Spin Coater[1] | — |
| Model | 200[1] | — |
| Make | CEE[1] | — |
| Wafer Sizes | 8 inch[1] | — |
| Configuration | 1 Phase[1] | — |
| Equipment type | Spin Coater[1] | — |
| Spin speed | 5000 rpm[2] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[2] | — |
| Substrate thickness max | 12 mm[2] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[2] | — |
| Maximum Substrate Size | — | ø150 mm wafers; 5" × 5" (127 mm × 127 mm) substrates[3] |
| Maximum Rotational Speed | — | 12,000 RPM (based on a ø100 mm silicon wafer)[3] |
| Process Controller | — | 650-series microprocessor controller with PC software support (Spin 3000); real-time interaction, pausing, stopping, and continuation[3] |
| Power Requirements | — | 95 to 240 VAC, 47/63 Hz, ~300 W[3] |
| Vacuum Requirements | — | 25–28 inHg (635–711 mm Hg) with flow 4.5 SCFM (0.127 m³/min) at 0 inHg[3] |
| Nitrogen Purge Pressure | — | 60–70 PSIG (4–5 bar) of N₂ or CDA; consumption 3 ft³/h (0.085 m³/h) for standard motor, 20 ft³/h (0.566 m³/h) for high-performance motor[3] |
| Housing Material | — | Solid co-polymer blend (proprietary); optional PTFE (Hostaflon TFM-1600 / Teflon AF) for high-temperature chemistry[3] |
| Safety Certifications | — | ETL, UL, CSA, CE, RoHS compliant; door interlock, vacuum interlock, lid interlock[3] |
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